· This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
· Curved pieces can be cut
Technology parameter | |
Maximum workpiece size (W×D×H) mm | 130× 160×130 × two editions |
Cutting blade thickness range (mm) | 1.5-8 straight piece/R≥6, chord height≤25 arc piece |
Sheave parameters(mm) | Φ130-Φ150×600 four-axis |
Table lifting stroke(mm) | Max 185 |
Cutting line speed (mark/min) | Up to 1200 |
Maximum storage capacity(m) | 30000 (0.2 diamond wire) |
Wire diameter (mm) | 0.10-0.25 |
Total Rated Power (kW) | 60.2 |
The weight of the whole machine | 6000 |
Dimensions of the main machine (W×D×H) (mm) | 2210×3200×2740 |
No evaluation information!