Tel：0315-6578888
E-mail：tsjingyu@163.com
Add：河北省唐山市玉田县玉田经济开发区城区产业园区
Semiconductor
The diamond wire cutting machine can process semiconductor materials into the required specifications through precise cutting to meet the needs of different application scenarios. Diamond wire cutting technology greatly improves the cutting efficiency and accuracy of wafers, while reducing cutting loss and environmental protection processing costs, providing important technical support and innovation power for the development of semiconductor manufacturing industry. |  |
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