Tel：0315-6578888
E-mail：tsjingyu@163.com
Add：河北省唐山市玉田县玉田经济开发区城区产业园区
Silicon carbide
Silicon carbide substrate cutting technology is the process of cutting SiC ingots into crystal flakes in a certain direction. SiC ingots are cut into wafers with low warpage and uniform thickness. The cutting method and cutting quality affect the thickness, roughness, size, wear and tear of the wafer, and the production cost. |  |
|
|
|
