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SDX1360HR-II. Multi-wire cutting machine

  • Product Introduction
  • · This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.

    · The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.

    · Curved pieces can be cut.








    Product Introduction


▶ This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
▶ The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
▶ Curved pieces can be cut.



Technical parameter

  Maximum workpiece size (W×D×H) mm

130× 160×130 × two editions

   Cutting blade thickness range (mm)

 1.5-8 straight piece/R≥6, chord height≤25 arc piece

  Sheave parameters(mm)

  Φ130-Φ150×600 four-axis

  Table lifting stroke(mm)

  Max 185

   Cutting line speed (mark/min)

   Up to 1200

   Maximum storage capacity(m)

  10000 (0.25 diamond wire)

  Wire diameter (mm)

  0.10-0.25

  Total Rated Power (kW)

49.8

  The weight of the whole machine

 5000

  Dimensions of the main machine (W×D×H) (mm)

2000×3050×2760


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