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YBDX6050-III multi-wire cutting machine

  • Product Introduction
  • · This machine is mainly used for cutting hard and brittle materials such as monocrystalline silicon, ceramics, glass, precious metals, etc., and diamond wire cutting is applied.

    · The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.

    · The upper worktable processing method is adopted, and the workpiece swings during the cutting process to improve the cutting efficiency.

    · The lightweight design of the pay-off wheel increases the storage capacity.





     


Technical parameters

  Maximum workpiece size (W×D×H) mm

Swing: 600× 500×600

  Cutting blade thickness range (mm)

1.5-30 straight sheets

  Sheave parameters(mm)

 Φ180-Φ200×500 four-axis

  Table lifting stroke(mm)

Max 600

Swing Angle (°)

±7.5

Cutting line speed(m/min)

 Up to 1800

Maximum storage capacity(m)

   50000 (0.25 diamond wire)

Wire diameter (mm)

0.25-0.37

Total Rated Power (kW)

77.6

   The weight of the whole machine

  14000

Host dimensions (width× length× height) (mm)2740×3790×3940


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