· This machine is mainly used for cutting hard and brittle materials such as monocrystalline silicon, ceramics, glass, precious metals, etc., and diamond wire cutting is applied.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· The lower workbench processing method is adopted.
· The lightweight design of the pay-off wheel increases the storage capacity.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | 560×500×560 |
Cutting blade thickness range (mm) | 1.5-30 straight sheets |
Sheave parameters(mm) | Φ140-Φ160×500 four-axis |
Table lifting stroke(mm) | Max 620 |
Swing Angle (°) | not |
Cutting line speed(m/min) | Up to 1000 |
Maximum storage capacity(m) | 50000 (0.25 diamond wire) |
Wire diameter (mm) | 0.25-0.37 |
Total Rated Power (kW) | 63.2 |
The weight of the whole machine | 9000 |
Dimensions of the main machine (W×D×H) (mm) | 2300×2600×3300 |
No evaluation information!