Tel：0315-6578888
E-mail：tsjingyu@163.com
Add：河北省唐山市玉田县玉田经济开发区城区产业园区
· This machine is mainly used for cutting hard and brittle materials such as monocrystalline silicon and polycrystalline silicon, and diamond wire cutting is applied.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· The upper worktable processing method is adopted, and the workpiece swings during the cutting process to improve the cutting efficiency.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | Swing: 300×500×700 |
Cutting blade thickness range (mm) | 0.55-15 straight film |
Sheave parameters(mm) | Φ180-Φ200×300 Four-axis |
Table lifting stroke(mm) | Max 380 |
Swing Angle (°) | ±9 |
Cutting line speed(m/min) | Up to 1800 |
Maximum storage capacity(m) | 30000 (0.25 diamond wire) |
Wire diameter (mm) | 0.12-0.25 |
Total Rated Power (kW) | 80 |
The weight of the whole machine | 10000 |
| Host dimensions (width× length× height) (mm) | 2380×3510×3470 |
No evaluation information！