· This machine is mainly used for slicing and processing hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· The lower worktable processing method is adopted, and the workpiece swings during the cutting process to improve the cutting efficiency.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | Square: 135×135×600 Circle: Φ150×600 |
Cutting blade thickness range (mm) | 0.5-8 straight films |
Sheave parameters(mm) | Φ160-Φ180X600 triaxial |
Table lifting stroke(mm) | Max 220 |
Swing Angle (°) | ±7.5 |
Cutting line speed (mark/min) | Up to 1800 |
Maximum storage capacity(m) | 30000 (0.25 diamond wire) |
Wire diameter (mm) | 0.10-0.25 |
Total Rated Power (kW) | 83.5 |
The weight of the whole machine | 9500 |
Dimensions of the main machine (W×D×H) (mm) | 2210X3670X2640 |
No evaluation information!