· This model is mainly used for slicing and processing of brittle hard materials such as crystal.
· It is suitable for small size cutting, cutting size 150×120×80mm.
· The processing method of the lower table is adopted, and the small blanks are flexibly arranged on the material plate.
· The structure of the whole machine is compact, and the space and weight are small.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | 150×120×80 |
Cutting blade thickness range (mm) | 0.3-1.5 straight film |
Sheave parameters(mm) | Φ110-Φ130×120 Four-axis |
Table lifting stroke(mm) | Max 150 |
Swing Angle (°) | Not |
Cutting line speed(m/min) | Up to 1200 |
Maximum storage capacity(m) | 10000 (0.25 diamond wire) |
Wire diameter (mm) | 0.10-0.25 |
Total Rated Power (kW) | 30 |
The weight of the whole machine | 2500 |
Host dimensions (width× length× height) (mm) | 1400×1500×1950 |
No evaluation information!