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DX600-III multi-wire cutting machine

  • Product Introduction
  • · This machine is mainly used for slicing and processing hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.

    · The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.

    · The upper worktable processing method is adopted.

    · The spindle sheave adopts the hydraulic loading and unloading method.

    · The cutting space can be opened on three sides for easy operation and maintenance.





Technical parameters

  Maximum workpiece size (W×D×H) mm

165×600×130

  Cutting blade thickness range (mm)

0.3-5 straight films

  Sheave parameters(mm)

Φ160-Φ180X600 two axes

   Table lifting stroke(mm)

Max 220

Swing Angle (°)

Not

Cutting line speed(m/min)

 Up to 1800

Maximum storage capacity(m)

  30000 (0.25 diamond wire)

Wire diameter (mm)

0.10-0.25

Total Rated Power (kW)

63

  The weight of the whole machine

 7500

Host dimensions (width× length× height) (mm)2290×3715×2660


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