· This machine is mainly used for slicing and processing hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· The upper worktable processing method is adopted.
· The spindle sheave adopts the hydraulic loading and unloading method.
· The cutting space can be opened on three sides for easy operation and maintenance.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | 165×600×130 |
Cutting blade thickness range (mm) | 0.3-5 straight films |
Sheave parameters(mm) | Φ160-Φ180X600 two axes |
Table lifting stroke(mm) | Max 220 |
Swing Angle (°) | Not |
Cutting line speed(m/min) | Up to 1800 |
Maximum storage capacity(m) | 30000 (0.25 diamond wire) |
Wire diameter (mm) | 0.10-0.25 |
Total Rated Power (kW) | 63 |
The weight of the whole machine | 7500 |
Host dimensions (width× length× height) (mm) | 2290×3715×2660 |
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