Tel：0315-6578888
E-mail：tsjingyu@163.com
Add：河北省唐山市玉田县玉田经济开发区城区产业园区
· This machine is mainly used for cutting hard and brittle materials such as monocrystalline silicon rods and polycrystalline silicon rods, and the diamond wire cutting is applied, and the cutting format is Φ300mm (12 inches).
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· The upper worktable processing method is adopted.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | Φ300×400 |
Cutting blade thickness range (mm) | 0.55-15 straight film |
Sheave parameters(mm) | Φ180-Φ200X300 two-axis |
Table lifting stroke(mm) | Max 360 |
Swing Angle (°) | Not |
Cutting line speed(m/min) | Up to 1800 |
Maximum storage capacity(m) | 30000 (0.25 diamond wire) |
Wire diameter (mm) | 0.12-0.25 |
Total Rated Power (kW) | 77.2 |
The weight of the whole machine | 10000 |
| Host dimensions (width× length× height) (mm) | 2290×3415×3030 |
No evaluation information！