Condensing the core and striving for development, the 6th Shenzhen International Semiconductor Exhibition of SEMI-e 2024 is about to be grandly opened!

The 6th Shenzhen International Semiconductor Exhibition (SEMI-e) 2024, sponsored by Shenzhen Zhongxin Materials Convention and Exhibition Co., Ltd., China Communications Industry Association, Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Shenzhen Semiconductor Industry Association, and Chengdu Integrated Circuit Industry Association, will be grandly opened on June 26-28 in Hall 4, 6 and 8 of Shenzhen World Convention and Exhibition Center (Baoan New Hall)! 815 exhibitors and 50+ enterprise representatives shared wonderfully, building a docking and two-way platform for the upgrading and development of the semiconductor industry chain!

The exhibits cover chip design, wafer fabrication and packaging, semiconductor special equipment & parts, third-generation semiconductors, electronic components, automotive semiconductors/automotive-grade packaging, AI and computing power, algorithms, storage, CPO co-packaging, etc.

Three halls and six areas

Condense the "core" and strive for development

Shenzhen is an important base for the application of semiconductor and integrated circuit design and manufacturing! With Shenzhen as the core, there are hundreds of proposed and under-construction projects in South China with an investment amount ranging from hundreds of millions to tens of billions, involving wafer fabs, silicon carbide, sensors, IC packaging, IC substrates, Mini LED displays, automotive semiconductors, artificial intelligence, Internet of Everything, wind and solar energy storage power devices, etc.

The third-generation semiconductor industry chain has an obvious upstream traction effect, and substrate, epitaxy, and device manufacturing are the key links that distinguish it from traditional semiconductor production, of which substrate and epitaxial production account for more than 60% of the cost. In the face of the huge application market of the third generation of semiconductors, a large number of enterprises are actively carrying out R&D and production, and have gradually established a relatively complete industrial chain from substrate, epitaxy, design, manufacturing, packaging and testing to application. With the rapid progress of science and technology, silicon carbide (SiC) and gallium nitride (GaN), as leaders in the field of semiconductor materials, are leading the innovation of a new generation of electronic technology with their performance and wide application prospects. Looking to the future, the market applications of these two materials will continue to expand, pushing the electronics industry to a higher stage of development.

50+ themed activities

Industry leaders talk about the future

Relying on the exhibition foundation of the 6th Shenzhen International Semiconductor Exhibition of SEMI-e, the "2024 China Automotive Semiconductor Conference", "The 5th Third Generation Semiconductor Industry Development Summit Technology Forum", "The 6th Shenzhen Semiconductor Industry Technology Summit" and "2024 Today's Semiconductor Localization Trend Summit" will be held at the same time. Cutting-edge technology and market trends.

The conference focused on the development status of China's automotive chip industry, the development and application of autonomous driving technology, the application of power devices in the new energy vehicle industry, the analysis of the current situation and application prospect of GaN/SiC technology, the special topic of semiconductor packaging, and the analysis of the market status and development trend of semiconductor equipment and core components.

(Redirected from: NetEase News Author: Semiconductor Circle)