· This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The processing method of lower double-station worktable is adopted, and the width of a single worktable is 160x1000mm, and the cutting efficiency is higher.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· 6 large diameter guide wheels are adopted, and the winding is fast.
· Lightweight design of take-up and pay-off wheels.
Technical parameters | |
Maximum workpiece size (W×D×H)mm | 160×1000×180×Two editions |
Cutting blade thickness range(mm) | 1.5-18Straight film |
Groove wheel parameters(mm) | Φ175-Φ190×1000 Five-axis |
Table lifting stroke(mm) | Max 220 |
Cutting line speed(m/min) | Highest2100 |
Maximum line storage capacity(m) | 30000(0.2Diamond wire) |
Wire diameter(mm) | 0.10-0.25 |
Total rated power(kW) | 160 |
The weight of the whole machine | 9500 |
Dimensions of the main machine (width× length × height)(mm) | 1900×3550×3150 |
No evaluation information!