· This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
Product Introduction
▶ This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
▶ The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
Technical parameters | |
Maximum workpiece size (W×D×H)mm | 160×600×180×Two editions |
Cutting blade thickness range(mm) | 0.5-18 Straight film |
Groove wheel parameters (mm) | Φ160-Φ180×600 Straight film |
Table lifting stroke(mm) | Max 220 |
Cutting line speed(m/min) | Highest 1800 |
Maximum line storage capacity(m) | 30000(0.2 Diamond wire) |
Wire diameter(mm) | 0.10-0.25 |
Total rated power(kW) | 88.2 |
The weight of the whole machine | 9000 |
Dimensions of the main machine (width× length × height)(mm) | 1975×2895×3165 |
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