· This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
· The maximum linear speed reaches 2600m/min.
· The table can be fine-tuned manually back and forth.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· Adopt 6 large diameter guide wheels, fast winding.
Technology parameter | |
Maximum workpiece size (W×D×H) mm | 160×600×180 × two editions |
Cutting blade thickness range (mm) | 0.4-18 straight films |
Sheave parameters(mm) | Φ195-Φ210×600 five axes |
Table lifting stroke(mm) | Max 220 |
Cutting line speed(m/min) | Up to 2600 |
Maximum storage capacity(m) | 30000 (0.2 diamond wire) |
Wire diameter (mm) | 0.08-0.25 |
Total Rated Power (kW) | 130 |
The weight of the whole machine | 10000 |
Dimensions of the main machine (W×D×H) (mm) | 1900×3080×3050 |
No evaluation information!