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SXQ1335 square machine

  • Product Introduction
  • · This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, single brittle materials, crystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.

    · The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.

    · There are 5 cutting units in each station, and the cutting size of each cutting unit is 130mmx70mmx150mm.

    · Horizontal mobile table is adopted.

    · The whole machine has a compact structure design and occupies a small space.






Technical parameters

  Maximum workpiece size (W×D×H) mm

130×70×150×10 plates (double station)

  Cutting blade thickness range (mm)

1-70 straight blades/R≥6, chord height≤25 arcs

 Sheave parameters(mm)

Φ140-Φ160X600 two-shaft + guide wheel

Table lifting stroke(mm)

  Max 180

 Cutting line speed(m/min)

  Up to 1200

   Maximum storage capacity(m)

  10000 (0.2 diamond wire)

 Wire diameter (mm)

  0.10-0.30

  Total Rated Power (kW)

33

  The weight of the whole machine

  3000kg

   Dimensions of the main machine (W×D×H) (mm)

1500×2700×2750


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