· This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, single brittle materials, crystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
· There are 5 cutting units in each station, and the cutting size of each cutting unit is 130mmx70mmx150mm.
· Horizontal mobile table is adopted.
· The whole machine has a compact structure design and occupies a small space.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | 130×70×150×10 plates (double station) |
Cutting blade thickness range (mm) | 1-70 straight blades/R≥6, chord height≤25 arcs |
Sheave parameters(mm) | Φ140-Φ160X600 two-shaft + guide wheel |
Table lifting stroke(mm) | Max 180 |
Cutting line speed(m/min) | Up to 1200 |
Maximum storage capacity(m) | 10000 (0.2 diamond wire) |
Wire diameter (mm) | 0.10-0.30 |
Total Rated Power (kW) | 33 |
The weight of the whole machine | 3000kg |
Dimensions of the main machine (W×D×H) (mm) | 1500×2700×2750 |
No evaluation information!