· This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, single brittle materials, crystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.
· The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.
· There are 11 cutting units in each station, and the cutting size of each cutting unit is 170mmx70mmx160mm.
· Horizontal mobile table is adopted.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | 170×70×160×22 plates (double station) |
Cutting blade thickness range (mm) | 1-70 straight blades/R≥6, chord height≤25 arcs |
Sheave parameters(mm) | Φ150X160X735 shaft + guide wheel |
Table lifting stroke(mm) | Max 180 |
Cutting line speed (mark/min) | Up to 1500 |
Maximum storage capacity(m) | 20000 (0.2 diamond wire) |
Wire diameter (mm) | 0.10-0.3 |
Total Rated Power (kW) | 49.6 |
The weight of the whole machine | 7000kg |
Dimensions of the main machine (W×D×H) (mm) | 2240×3100×2380 |
No evaluation information!