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DX5056ZS-II multi-wire cutting machine

  • Product Introduction
  • · This machine is mainly used for cutting hard and brittle materials such as monocrystalline silicon, ceramics, glass, precious metals, etc., and diamond wire cutting is applied.

    · The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.

    · The lower workbench processing method is adopted.

    · The lightweight design of the pay-off wheel increases the storage capacity.








Technical parameters

  Maximum workpiece size (W×D×H) mm

560×500×560

    Cutting blade thickness range (mm)

1.5-30 straight sheets

  Sheave parameters(mm)

 Φ140-Φ160×500 four-axis

  Table lifting stroke(mm)

Max 620

Swing Angle (°)

Not

Cutting line speed(m/min)

Up to 1000

Maximum storage capacity(m)

 50000 (0.25 diamond wire)

Wire diameter (mm)

0.25-0.37

Total Rated Power (kW)

63.2

  The weight of the whole machine

  9000

Dimensions of the main machine (W×D×H) (mm)2300×2600×3300


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