Tel：0315-6578888
E-mail：tsjingyu@163.com
Add：河北省唐山市玉田县玉田经济开发区城区产业园区
· This machine is mainly used for cutting hard and brittle materials such as monocrystalline silicon and polycrystalline silicon, and diamond wire cutting is applied.
· The double-wall structure roller is used to ensure the stable and reliable operation of the spindle at high speed.
· The upper worktable processing method is adopted.
Technical parameters | |
Maximum workpiece size (W×D×H) mm | 300×500×300 |
Cutting blade thickness range (mm) | 0.55-15 straight film |
Sheave parameters(mm) | Φ180-Φ200×300 Four-axis |
Table lifting stroke(mm) | Max 360 |
Swing Angle (°) | Not |
Cutting line speed(m/min) | Up to 1800 |
Maximum storage capacity(m) | 30000 (0.25 diamond wire) |
Wire diameter (mm) | 0.12-0.25 |
Total Rated Power (kW) | 77.2 |
The weight of the whole machine | 10000 |
| 主机外形尺寸(宽×长×高)（mm | 2290×3510×3030 |
No evaluation information！