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Development history of precision cutting equipment

2020-03-10 15:24:53
Times

The multi-wire cutting machine is a new type of cutting equipment with a brand-new concept. It has been more than 40 years since the concept of multi-wire cutting was proposed in the 1960s and it has become more perfect today. Limited to the technical level and control concept at that time, it is indeed quite difficult to put multi-wire cutting into the world. The multi-wire cutting machine that can be used in the world in the mid-1980s came out. Among them, the mechanical structure is mainly used, the wire tension control is used for the magnetic powder clutch, the tension adjustment uses an AC motor with a reducer, and it is also equipped with a huge gear reducer and chain gear transmission structure. The electronic control is mainly a relay and a time relay. Regardless of the organization, it is, after all, a prototype multi-wire cutting machine. Since 1986-1987 was experimental; 1988-1990 is the second generation. The next two or three years will be a new generation. The ninth and tenth generation multi-wire cutting machines are already on the market today.


The multi-line machine cuts the wafer with a small bow, low warp, and good parallelism. The small total thickness tolerance (TTV) is small, the cutting loss between the chips is small, the surface damage of the processed wafer is shallow, the roughness is small, the chip processing rate is high, the production efficiency is high, and the investment return is high.


Therefore, the application of multi-wire cutting machine is an inevitable choice to develop large-scale production and improve production efficiency. The use of multi-wire cutting machine to process various types of wafers is an inevitable trend, especially suitable for batch processing of solar photovoltaic cell ultra-thin machine substrates.


Entering the technological advancement and technological development of the 21st century, the technological content of modern multi-wire cutting machines has become the same as that of the 1980s. Today ’s multi-wire cutting machines have integrated modern manufacturing technology, process technology, modern control technology, and modern sensing. Technology and new materials, such as AC servo motors and drive systems, industrial control computers, motion control cards and bus systems, spindle oil mist lubrication cooling and gap sealing units, constant tension rapid routing, etc. Due to the choice of the above system, the modern multi-wire cutting machine is suitable for the slicing of various hard and brittle materials such as large-diameter IC silicon wafer photovoltaic cell substrate ultra-thin, gallium arsenide, silicon carbide, lithium niobate, optical glass and other hard and brittle materials .


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