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SDX1660-IV Multi-wire Cutter

  • Product Introduction
  • · This machine is mainly used for cutting hard and brittle materials such as crystal, artificial gemstones, monocrystalline silicon, ceramics, glass, precious metals, magnetic materials, etc.

    · The processing method of the lower double-station worktable is adopted, and the cutting efficiency is higher.










Technology parameter

    Maximum workpiece size (W×D×H) mm

160×600×180 × two editions

 Cutting blade thickness range (mm)

  0.5-18 straight films

 Sheave parameters(mm)

   Φ160-Φ180×600 five axes

  Table lifting stroke(mm)

  Max 220

   Cutting line speed (mark/min)

  Up to 1800

  Maximum storage capacity(m)

  30000 (0.25 diamond wire)

  Wire diameter (mm)

  0.10-0.25

  Total Rated Power (kW)

 112

 The weight of the whole machine

 9500

  Dimensions of the main machine (W×D×H) (mm)

  2700×3300×2800


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